Amicra AFC

Fully Automatic High Accuracy Micro Assembly Cell

     Key Features

• ±0.5µM Placement accuracy
• Cycle time <30sec
• Flip-Chip option
• Assembly of chip & micro-optics
  • WDM, optoelectronic components, micro-lenses, micro-mechanics
• Die sorting
• Wafer Mapping
• Eutectic bonding via diode-laser or heating plate
• Epoxy stamping & dispensing
• UV cure option
• Active / Passive alignment
• Active bond force control
• Post bond inspection
• Modular machine concept

High Precision Bondhead

• Bondhead for final alignment

• Active bond force control

• XY-Piezo axis

  • resolution: 0.1µM

  • working area X/Y: 300µM/500µM

• Rotatable bond-tool

  • resolution: 0.01°

  • working area: 360°

UV Cure option

Amicra AFC Video    Amicra AFC+ Video           Amicra AFC brochure (PDF)

Contact Paul Bampton for further information