PDP - Delvotec 5310

5310 Manual Ball Bonder

The 5310 Manual Ball Bonder can process Gold wire from 17.5 to 50 μM, using both a bumping mode as well as stitch-bond mode.
The motor driven Z-axis ensures repeatable results.
Parameters can be saved to the internal hard disc drive.
User interface is via a colour display and shuttle-wheel making programming of the machine very easy.
The operator can create different kinds of loops with the manipulator system.
Operators require only minimal training, making the 5310 Manual Ball Bonder the ideal choice for prototyping, rework and small scale production.

5310 Ball Bonder Specifications

Concept

DC motor driven linear Z axis

Single board PC with Windows® operating system

Menu controlled teach

User interface via colour screen and shuttle-wheel with push-button

Wire types

Gold wire; 17.5 - 50 μM on 2" spool. Optional ½“ spool

Bondhead

Contactless electronic touchdown sensor

Programmable Ultrasonic Generator 0 - 5W 60 kHz standard. (Other frequencies optional)

Negative Electronic Flame Off

Bond force; programmable, 15 - 150g

Capillaries; 9 - 16mm length

Step precision; 1μM

Display

6.5” TFT Colour Display. 640 x 480 Pixel (VGA)

Working area

Bondhead linear Z travel: 60 mm

Standard work height: 55mm

X&Y Manipulator; 18 x 18 mm Movement ration; 7:1

Workholder

Digitally controlled heated stage

Standard Ų - 60 mm for samples to 2" x 2", mechanical clamping

4" x 4", 80 mm & 95 mm optional, also with vacuum (4" x 4” up to 200°C, 80mm up to 250°C)

Control modes

Manual, semi-automatic

Program line step for testing via Shuttle-wheel

Loop types

Ball-Wedge, Bumping, Reverse, Stitch, Programmable

Dimensions

Height: 400mm, Width: 630mm, Depth: 580mm. Weight approx. 30kg

Programme Storage

Internal Hard Disc Drive