Amicra SDB

Semi Automatic High Accuracy Micro Assembly Cell

     Key Features

• ±1µM Placement accuracy
• Cycle time <60sec
• Flip-Chip option
• Assembly of chip & micro-optics
  • WDM, optoelectronic components, micro-lenses, micro-mechanics
• Die sorting
• Wafer Mapping
• Eutectic bonding via diode-laser
• Epoxy stamping & dispensing
• Active / Passive alignment
• Active bond force control
• Post bond inspection
• Modular machine concept

• Closed loop control with position sensor

• Working area

  • 3-100cN / 0.5cN resolution

  • 1-25 cN / 0.2 cN resolution

• Touch down sensor

• Massive, web-cast frame

• Superior vibration attenuation

• Rigid microscope bridge

Amicra SDB brochure (PDF)

Contact Paul Bampton for further information