Amicra NovaPlus

High Speed Dual Head Die Bonder

     Key Features

• UPH up to 4000 (±10µM @ 3sigma, including Flip-Chip)
• UPH up to 1200 (±3µM @ 3sigma, including Flip-Chip)
• Flip-Chip & Die Attach options
• Automatic load of Wafer & Substrate
• Dynamic alignment
• Eutectic bonding via diode-laser or heating plate & hot bond tool
• Epoxy stamping & dispensing options
• Micro dispensing; dot size up to 150µM
• Wafer mapping
• Active bond force control
• Post bond inspection
• Wafer mapping
• Modular machine concept
• Easy configure software

Amicra NovaPlus Video          Amicra NovaPlus Datasheet (PDF)

Contact Paul Bampton for further information