Questar Automatic Bonders

                              Q7700 and Q7800 Automatic Wire Bonders

                                                        INCREASE ACCURACY, RELIABILITY, and USEABILITY

                                            REDUCE MAINTENANCE AND TRAINING COSTS

The Q7700 Automatic Ball Bonder and Q7800 Automatic Wedge Bonder include such capabilities as Fine Pitch, Large Table Travel, and Ball Bumping for Flip Chip, as well as Customizable Software.

Questar Products has re-engineered and modernized the industry proven K&S 1419 and K&S 1470™ to create a more productive, easy to maintain and very user friendly new line of ball and wedge bonders.

These current technology machines provide a moderately priced, cost effective, large area bonding solution with features needed for complex hybrid, opto-electronic, medical, and other single or multichip devices.

Questar offer turn-key installations, as well as the remanufacturing of customers' existing equipment

Q7700 Datasheet             Q7800 Datasheet

Questar's new machines, include such state of the art features as:

• Point and Click Bonding

• Fast, Accurate PRS
• Fine Pitch Capability
• Ball Bumping and Coining Capability
• Programmable Security Bonds
• Large 4" X 4" Bonding Area
• Simple, Intuitive Programming
• Easy Bond Process Editing
• Extensive Program Storage
• Bond Parameter Library
• Flat Panel Monitor
• Solid State Vision System
• Galil Motion Control System
• Matrox Imaging Pattern Recognition System
• Pentium Computer with Windows 2000 OS

WE ALSO OFFER CUSTOM SOLUTIONS FOR UNIQUE APPLICATIONS