Pac Tech - Packaging Technologies is a worldwide
leader in both
Wafer Level Bumping & Packaging
Advanced Packaging Equipment
Pac Tech has over 15 years of experience in the industry and has
manufacturing sites all around the world, including: Germany, United
States, Japan, and Malaysia. These sites can supply both engineering
and prototyping services, as well as high volume production.
Pac Tech is structured to provide a single source for all
Contract Bumping and Wafer Level Packaging Services,
as well as providing turn key Advanced Packaging Equipment.
The core technologies that Pac Tech offer are centred around
Electroless Nickel/Gold Bumping
Laser Based Solder Deposition
Pac Tech's philosophy is to integrate its leading technology
developments into high quality equipment for high volume production.
Electroless Nickel Technology
is recognized throughout the industry as the highest quality
process. The technology portfolio includes: Ni/Au and Ni/Pd
Under-Bump-Metallization (UBM) for solder bump attach.
Thin Ni/Au and Ni/Pd/Au is applied for pad re-metallization (OPM)
in high reliability wirebonding and wirebonding over active pad.
The NiPd (Au) OPM is compatible with both Gold and Copper
wirebonding. Tall Ni/Au bumps are used for ACF and ACA flip
chip attach. Pac Tech offers plating services on both Aluminum
and Copper Pads, as well as plating on 100, 150, 200, and 300mm
wafers. The process allows plating on Si, GaAs, InP, and LiTaO3
We offer processes for solder bump deposition including Wafer
Level Solder Ball Attach using Pac Tech's
addition to traditional solder paste printing. Laser Assisted Solder
Jetting with PacTech's
is applied for maskless fast prototyping and special
products including fluxless, 3D and low / high temperature solder
alloys. The combination of these technologies allows us to provide
the widest product range to our customers; servicing the ASIC,
Foundry, Military, Medial, Aerospace, Consumer, Memory, MEMS, Probe
Card, and Disc Drive industries.
As a full service provider, Pac Tech offers a complete set of
Wafer Level and Backend Services, including: Sawing
/ Dicing, Tape & Reel, Redistribution, Repassivation, Backside Laser
Marking, Backgrinding, Backside Metal Deposition / Coating, Test,
and Wafer Level Component / Capacitor / Resistor Assembly.
A special highlight is our turnkey service for PowerMOSFET
Devices. We provide one-stop offering of Frontside
Metallization based on e'less Ni/Au and Backside
Metallization by Ti/Ni/Ag evaporation.
In addition, Pac Tech has the latest in metrology and analytical
equipment to help in the development and production processes,
including: X-ray, Bump / Die Shear Test, High Speed Pull Test, AOI,
ICP, AA, Probing, SEM / FIB / EDX and Chemical Analysis.
Pac Tech provides state-of-the-art automated equipment to the Wafer
Level Packaging and Backend industries. This equipment is divided
into three separate platforms: e-Ni/Au
The cornerstone to Pac Tech's equipment offering is the fully
automatic electroless nickel plating line
(PACLINE™ Series 200 and 300).
This sytem allows for processing 100-300mm wafer with Ni, Pd, and Au
at volumes of over 600,000 parts per year. In addition, Pac Tech
offers the peripheral equipment associated with electroless plating,
including: plasma clean
resist and dielectric coating
megasonic solvent cleaning
Pac Tech offers two different equipment platforms for depositing
solder on top of the e-Ni/Au UBM. These include the
Laser Assisted Solder Jetting (SB²)
tools and the
Solder Sphere Transfer (Ultra-SB²)
tools. The laser based tool is ideal for prototyping and low volume
bumping applications like MEMS, Military, and Medical, but also for
special bumping applications like: single die, probe cards,
substrates, and disc drive heads. The solder transfer tool is ideal
for high yield and high volume bumping applications.
To facilitate a full turn key solution to their equipment line, Pac
Tech offers a full set of additional equipment for Wafer Level
Packaging and Backend applications, including: laser based assembly
LAPLACE™ FC and WLP,
Automated Optical Inspection (AOI HS³)
Laser Marking (LS²).