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K&S 4524 Ball Bonder

 

 

         4524 Manual Bonder
  • Can be configured for Ball Bumping / TAB bonding
  • Designed for Gold wire
  • Semi-auto and manual operation modes
  • Individual bonding parameter control.
  • Wide range of wire diameter
  • Has built in programmable NEFO system that provides fine control and consistency of ball size

                    NEFO = Negative Electronic Flame Off

Other Features

  • Consistent ball size
  • Missing ball detector system
  • Easy operation (semi-auto, manual)
  • Large bonding area
  • Deep access option (0.0650" length Capillary)
  • Direct access and simple adjustment to all bond parameters and programs
  • Especially designed for bonding applications from simple discrete devices to complex hybrid and microwave devices
 
 

 

4524 Ball Bonders Specification

Wire Gold = 17.5µ to 75µ Spool = 2"
Bonding Area 152 X 152mm (6 X 6 inch)
Throat Depth 143mm (5.6 inch)
Gross Table Motion 140mm (5.5 inch)
Fine Table Motion 14mm (0.55 inch)
Mouse Ratio 6:1
Z-Motion System DC servo/LVDT control
Z Travel 9.1mm
Ultrasonic System High Q 60kHz transducer PLL ultrasonic generator
Low Ultrasonic power 1.3W
High Ultrasonic Power 2.5W
Bond Time 10-100 mSec / 10-1000 mSec
Single Point TAB Available
Bond Force Force coil 10-160gr.
Modes of Operation Semi-auto, Manual Z

4524 Datasheet

Possible Options:

  • Microscopes and eyepieces
  • Deep access kit for 500 mil Z travel
  • Manual height adjustable, heated workholders
  • Spot light target

 

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