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     Tresky T-3000 & T-3002 Manual Die Bonder

 

 

 

T-3000-FC3 Manual Die Bonder with semi-auto process capabilities

'Force Control' Z Axis, pick-up from Waffle / Gel-Pak

The T-3000-FC3 series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the FC3 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the FC3 platform is the industry’s most sophisticated system in its class.

 

 

T-3002-M Manual Die Bonder

Manual Z Axis, Pick up from Wafer or Waffle  / Gel-Pak

The T-3002-M is a manual, precise, high quality die bonder & component placer with superior ergonomic design and a fix die ejector needle. As with all of Tresky’s products, the T-3002-M incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

The T-3002-M is equipped with Tresky's die ejector system for pick-up from wafer.

 

   

 

Overview of range

T-3000-M        Manual Z Axis, Pick up from Waffle  / Gel-Pak

T-3000-FC3    'Force Control' Z Axis, pick-up from Waffle / Gel-Pak

T-3002-M        Manual Z Axis, Pick up from Wafer or Waffle  / Gel-Pak

T-3002-FC3    'Force Control' Z Axis, pick-up from Wafer or Waffle / Gel-Pak

 

 

T-3000-FC3 Datasheet

T-3002-M Datasheet

T-3002-FC3 Datasheet

     

T-3xxx Video

 

 

 

 

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