PDP - Bondtec 5832

5832 Semi-Automatic Deep Access Fine Wire Wedge Bonder

The deep access fine wire Wedge version of the automatic wire bonders in our 58xx Series featuring exchange able bond heads.
A fully automatic mode makes it ideally suited for medium-scale production.
Parts to be bonded are fed manually by the operator, but the bonds are produced completely without operator influence. Thanks to the built-in pattern recognition (optional).
Single bonds can be made within seconds, making the machine perfect for R&D, Pilot manufacturing and mid volume production.

Bondtec 5832 Datasheet 58xx Video
5832 Deep Access Fine Wire Wedge Bonder Specifications
Wire types	Aluminium & Gold wire 17,5 … 75 μm on 2” spool Ribbon 30µm x 12.5µm - 250µm x 25µm Motorised wire spool (optional)
Bondhead	Wedge-Wedge for fine wire & ribbon Standard wedges, 1" length, 0.750" optional 90° wire feed
Ultrasonic system	F&K Generator 60 kHz /100 kHz (further frequencies on request)
Axes	Working area X/Y-axis 200 x 150 mm; step resolution 0,3 μm Programmable Z axis with 100 mm stroke; step resolution 0,3 μm
Hardware	Dual-Core PC with Windows 7 OS Ethernet, USB 2.0/3.0 LCD Colour Display 22” GigE-CCD-Colour Camera, 5 Mpixel Fully networkable in TCP/IP servers for program archiving
Software	From single bonds up to complex programmes Step & Repeat Loop shapes can be stored in libraries Optionally: pattern recognition with pseudo-error check
Dimensions	W x D x H 92 x 71 x 65 cm, weight approx. 80 kg
Connections	100 - 240 VAC, single phase, 50/60 Hz, max. 230 VA 6mm Ø standard vacuum tubing
Workholder heater control	Integrated, 0 - 300°C