The automatic and semi-automatic Heavy Wire Wedge Bonder 5650 is fully PC controlled and allows any number of bonds to be programmed. Pre-programmed adjust points are targeted through the camera's cross-hair targeting system (Pattern Recognition System optional) and the programmed bonds are executed automatically.

Two operating modes are available; Single bond for repair of various bond samples and making single bonds (manual-automatic) and multi wire for teaching and bonding chips or various bond samples (semi and fully automatic).

The 5650 is part of the 56xx family which consists of a base machine plus a bondhead for each of your required processes. As such it can also be used as a 30°/45° wedge, deep access wedge, ball, or heavy ribbon bonder as well as pull-/shear tester by simply replacing the bondhead and loading the appropriate software. Set-up time approx. 5 minutes.