PDP - Delvotec 5632 DA

5632 DA Semi-Automatic Deep Access Wedge Bonder

The automatic and semi-automatic Deep Access Wedge Bonder 5632 DA is fully PC controlled and allows any number of bonds to be programmed. Pre-programmed adjust points are targeted through the camera's cross-hair targeting system (Pattern Recognition System optional) and the programmed bonds are executed automatically.
Two operating modes are available; Single bond for repair of various bond samples and making single bonds (manual-automatic) and multi wire for teaching and bonding chips or various bond samples (semi and fully automatic).
The 5632 DA is part of the 56xx family which consists of a base machine plus a bondhead for each of your required processes. As such it can also be used as a 30°/45° wedge, ball, heavy wire or heavy ribbon bonder as well as pull-/shear tester by simply replacing the bondhead and loading the appropriate software. Set-up time approx. 5 minutes.

5632 DA Wedge Bonder Specifications

XY Table	Working area: 100 x 100mm (4" x 4") Resolution 0.25 μM, repeatability < 2 μM	Bondtec 5632 DA Datasheet 56xx Video
Z Axis	60mm
Speed	All axes programmable from 0.2 - 16mm/s 30 wires / minute
Wire types	Aluminium or Gold wire; 17.5 - 75 μM on 2" spool Aluminium or Gold ribbon; 30μM x 12.5μM - 250μM x 25μM
Bondhead	Rotating ±360° 90° wire feed angle Wedge length; 0.750" or 1" 60 / 100 KHz Ultrasonics standard, 140 KHz optional
Computer	Single Board PC, 600 MHz Pentium processor, 256 MB RAM Ethernet, USB, 4 x rear + 4 x front Monitor, 15" TFT Flat Screen Operating System: Windows 2000®
Lighting	20W Halogen spotlight and LED direct light
Workholder	Digitally controlled heated stage Standard Ø - 60 mm for samples to 2" x 2", mechanical clamping 4" x 4", 80 mm & optional, also with vacuum (4" x 4” up to 200°C, 80mm up to 250°C)
Dimensions	Height: 700mm, Width: 700mm, Depth: 650mm. Weight approx. 70kg