PDP - Delvotec 5610

5610 Semi-Automatic Ball Bonder

The automatic and semi-automatic Gold Ball Bonder 5610 is fully PC controlled and allows any number of bonds and bumps to be programmed. Pre-programmed adjust points are targeted through the camera's cross-hair targeting system (Pattern Recognition System optional) and the programmed bonds or bumps are executed automatically.
Two operating modes are available; Single bond for repair of various bond samples and making single bonds (manual-automatic) and multi wire for teaching and bonding chips or various bond samples (semi and fully automatic).
The 5610 is part of the 56xx family which consists of a base machine plus a bondhead for each of your required processes. As such it can also be used as a fine wire Wedge (30°/45° or 90°), heavy wire or heavy ribbon bonder as well as pull-/shear tester by simply replacing the bondhead and loading the appropriate software. Set-up time approx. 5 minutes.

5610 Ball Bonder Specifications

XY Table	Working area: 100 x 100mm (4" x 4") Resolution 0.25 μM, repeatability < 2 μM	Bondtec 5610 Datasheet 56xx Video
Z Axis	60mm
Speed	All axes programmable from 0.2 - 16mm/s 30 wires / minute
Wire types	Gold wire; 17.5 - 50 μM on 2" spool
Bondhead	Gold Ball Negative Electronic Flame Off 60 KHz Ultrasonics standard, 100 KHz optional
Computer	Single Board PC, 600 MHz Pentium processor, 256 MB RAM Ethernet, USB, 4 x rear + 4 x front Monitor, 15" TFT Flat Screen Operating System: Windows 2000®
Lighting	20W Halogen spotlight and LED direct light
Workholder	Digitally controlled heated stage Standard Ø - 60 mm for samples to 2" x 2", mechanical clamping 4" x 4", 80 mm & optional, also with vacuum (4" x 4” up to 200°C, 80mm up to 250°C)
Dimensions	Height: 700mm, Width: 700mm, Depth: 650mm. Weight approx. 70kg