PDP - Delvotec 5330

5330 Manual Wedge Bonder

The 5330 Manual Wedge Bonder can process Aluminium & Gold wire from 17.5 to 75 μM. It is also possible to bond ribbon up to 125µM (0.005") in width.
The motor driven Z-axis ensures repeatable results.
Parameters can be saved to the internal hard disc drive.
User interface is via a colour display and shuttle-wheel making programming of the machine very easy.
The operator can create different kinds of loops with the manipulator system.
Operators require only minimal training, making the 5330 Manual Wedge Bonder the ideal choice for prototype, rework and small scale production.

5330 Wedge Bonder Specifications

Concept

DC motor driven linear Z axis

Single board PC with Windows® operating system

Menu controlled teach

User interface via colour screen and shuttle-wheel with push-button

Wire types

Aluminium & Gold wire; 17.5 - 75 μM on 2" spool. Optional ½“ spool

Bondhead

45° & 60° wire feed angle

Clamp tear

Contactless electronic touchdown sensor

Programmable Ultrasonic Generator 0 - 5W, 60 or 100kHz selectable

Bond force; programmable, 15 - 150g

Display

6.5” TFT Colour Display. 640 x 480 Pixel (VGA)

Working area

Bondhead linear Z travel: 60 mm. Step precision: 1µM

Standard work height: 70mm

X&Y Manipulator; 18 x 18 mm Movement ration; 7:1

Workholder

Digitally controlled heated stage

Standard Ų - 60 mm for samples to 2" x 2", mechanical clamping

4" x 4" & 80 mm optional, also with vacuum (4" x 4” up to 200°C, 80mm up to 250°C)

Control modes

Manual, semi-automatic

Program line step for testing via Shuttle-wheel

Loop types

Standard rectangular, Reverse, Stitch, Programmable

Dimensions

Height: 400mm, Width: 630mm, Depth: 580mm. Weight approx. 30kg

Programme Storage

Internal Hard Disc Drive